发明名称 |
Use of a stainless steel sheet having Cu-enriched grains dispersed in its matrix and/or a Cu-condensed layer |
摘要 |
The stainless steel sheet according to the present invention has a stainless steel substrate 1 which contains Cu at a ratio of 1.0 mass % or more and has Cu-enriched grains 2 precipitated at a ratio of 0.2 vol.%. The Cu-enriched grains 2 are exposed outside through pinholes 4 of a passive film 3 generated on the substrate 1. Cu is preferably condensed at a Cu/(Cr+Si) mass ratio of 0.1 or more or a Cu/(Si+Mn) mass ratio of 0.5 or more with respect to Cr, Si and Mn present in the passive film 3 or at an outermost layer of the substrate 1. Precipitation of Cu-enriched grains 2 and condensation of Cu effectively improve solderability and electric conductivity of the stainless steel sheet 1. <IMAGE> |
申请公布号 |
EP1087027(A1) |
申请公布日期 |
2001.03.28 |
申请号 |
EP20000119431 |
申请日期 |
2000.09.14 |
申请人 |
NISSHIN STEEL CO., LTD. |
发明人 |
HIRAMATSU, NAOTO;NAKAMURA, SADAYUKI;KAGEOKA, KAZUYUKI |
分类号 |
C23C10/00;C21D6/00;C21D8/02;C22C38/04;C22C38/42;C23C8/18 |
主分类号 |
C23C10/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|