| 摘要 |
A wafer polishing apparatus according to this invention has a polishing unit that includes three platens and two polishing heads. Injection ports are disposed between the platens. The two polishing heads can linearly move between the platens. In a two-step polishing process, while the polishing head holds a wafer after polishing by a platen, the wafer is transferred to a center platen which provides different polishing characteristics. In this instance, washing water from the injection ports washes away slurry, etc, adhering to the wafer. The wafer is then carried to the center platen beyond a waiting unit and is subjected to further polishing. |
