发明名称 |
Photosensitive resin composition and patterning method |
摘要 |
<p>A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 10 mu m thick layer of precursor has light transmittance at a wavelength of 365 nm of at least 1% and a 10 mu m thick polyimide film made from the resin composition by imidation ring closure and deposited on a silicon substrate results in a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.</p> |
申请公布号 |
EP1087263(A2) |
申请公布日期 |
2001.03.28 |
申请号 |
EP20000120167 |
申请日期 |
2000.09.22 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. |
发明人 |
SASAKI, AKIHIRO;ARAI, NORIYOSHI;KAJI, MAKOTO;AUMAN, BRIAN C.;HAGIWARA, TOSHIKI |
分类号 |
C08G73/10;G03F7/037;C08F2/48;C08F299/02;C08L79/08;G03F7/004;G03F7/028;G03F7/038;G03F7/039;G03F7/075;G03F7/26;G03F7/40;H01L21/027;H05K1/00;(IPC1-7):G03F7/038 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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