| 摘要 |
<p>An electro-optic device (2, 2a) includes a transparent glass substrate (3), a dielectric tape layer (4) and a semiconductor die (5, 5a). The glass substrate (3) has a pad mounting surface (32) with a plurality of first contact pads (31) provided thereon. The dielectric tape layer (4) has opposite first and second adhesive surfaces (41, 42). The first adhesive surface (41) is adhered onto the pad mounting surface (32) of the glass substrate (3). The dielectric tape layer (4) is formed with a plurality of holes (43) at positions registered with the first contact pads (31) . Each of the holes (43) is confined by a wall that cooperates with a registered one of the first contact pads (31) to form a contact receiving space. Conductive contacts (45, 45', 45") are placed in the contact receiving spaces, respectively. The semiconductor die (5, 5a) has a die mounting surface (51) adhered onto the second adhesive surface (42) of the dielectric tape layer (4). The die mounting surface (51) is provided with a plurality of second contact pads (52) that are bonded to the conductive contacts (45, 45', 45") to establish electrical connection with the first contact pads (31) . A method for manufacturing the electro-optic device (2, 2a) is also disclosed. <IMAGE></p> |
