发明名称 Substrate processing system, interface apparatus, and substrate transportation method
摘要 An interface apparatus places, in a boat, plural wafers transported thereto one by one from an application apparatus for performing single wafer processing, then transports the boat having the wafers placed therein to a heating apparatus for subjecting plural wafers to a heat treatment process, and after completion of the heat treatment process, receives the boat. The interface apparatus includes a stage, a rotary table rotatably arranged on the stage for placing the boat thereon, and a positioning mechanism for turning the rotary table in a direction of displacement of the boat to permit the boat to be placed on the rotary table when the boat is being placed on the rotary table with the position thereof displaced from a reference position in a rotatable direction of the rotary table, and after completion of the placement, turning the rotary table in a direction opposite to the displacement direction to thereby position the boat at the reference position.
申请公布号 US6206974(B1) 申请公布日期 2001.03.27
申请号 US19980196734 申请日期 1998.11.20
申请人 TOKYO ELECTRON LTD. 发明人 IIDA NARUAKI;SHIGAKI YUKIO
分类号 B65G49/07;B25J11/00;H01L21/22;H01L21/677;(IPC1-7):C23C16/00 主分类号 B65G49/07
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