发明名称 JUDGING DEVICE AND MONITORING METHOD FOR TERMINATION POINT OF POLISHING PROCESS
摘要 PROBLEM TO BE SOLVED: To detect the termination point of a polishing process precisely by monitoring the change of the concentration of a material in the slurry on the downstream side of a raw material. SOLUTION: A monitoring element with two electrodes 128 is used to monitor the conductivity change of an outflow object or an outflow object component passing through a conduit 142. The electrodes 128 measure the conductivity change of an abrasive slurry or an abrasive slurry component after a material causing a conductivity change is removed from a raw material. A valve 145 controls the flow of the outflow object in the conduit 142 so that a large quantity of the slurry is kept above and below the electrodes 128, thereby the conductivity measurement of the electrodes 128 can be kept constant. A controller 120 controls a motor 106 to stop a platen 102 being rotated and/or controls a motor 114 to stop a raw material carrier 110 being rotated in response to the change of the signal transferred from the electrodes 128.
申请公布号 JP2001079759(A) 申请公布日期 2001.03.27
申请号 JP20000237499 申请日期 2000.08.04
申请人 FUJITSU LTD 发明人 MICHAEL G LEE;SOLOMON VALIN
分类号 B24B37/013;H01L21/304;H01L21/306 主分类号 B24B37/013
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