| 摘要 |
A multi-chip module may be formed by wire bonding a first chip within a cavity in a multi-chip carrier. A second die may be positioned over the first die, elevated therefrom, using bump bonding. In some embodiments, only a single cavity is utilized and in other embodiments, multiple cavities may be utilized, one of which mounts a first chip and the other of which mounts a second chip. In some embodiments, the second chip may be a composite of two dice coupled back-to-back so that the lowermost die may be bump bonded to the carrier and the uppermost die, facing upwardly away from the carrier, may be wire bonded thereto.
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