| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-density LSI module which can use ordinary LSI chip as it is and can eliminate the need for an area for mounting leads or wires, and a method for manufacturing the module. SOLUTION: A plurality of LSIs 1 to 4 having respective electrode leading pads 1a to 4a are stacked and the pads are integrally molded with resin 5 to 7. Each of the LSIs 1 to 4 is formed with a hole 8 which is passed through the LSI in the stacked layer direction at its electrode leading pad position, and the hole 8 is filled with a conductive resin 9 The conductive resin 9 causes the electrode leading pads 1a to 4a of the LSIs 1 to 4 to be electrically connected with each other. Elimination of the need for leads or wires enables realization of a high mounting density. Further, elimination of the need for special-structured electrode leading pads enables application of the invention to ordinary LSIs. |
