发明名称 Method of making semiconductor device having double spacer
摘要 A semiconductor device having a double spacer and a method of manufacturing the device are provided. The semiconductor device includes a first spacer formed on the sidewall of a gate electrode and a second spacer formed on the slanted sidewall of the first spacer. A first impurity region is formed doped with a first conductivity type impurity at a first concentration and formed at a small junction depth in the substrate to self-align at the edge of the gate electrode. A second impurity region doped with second conductivity type impurity at a second concentration is formed at a large junction depth in the substrate to self-align at the edge of the first spacer. A third impurity region doped with the first conductivity type impurity at a third concentration is formed at a medium junction depth in the second impurity region to self-align at the edge of the second spacer.
申请公布号 US6207519(B1) 申请公布日期 2001.03.27
申请号 US19980158875 申请日期 1998.09.23
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 KIM HYUN-SIK;SHIN HEON-JONG
分类号 H01L29/78;H01L21/22;H01L21/336;H01L27/088;H01L29/10;(IPC1-7):H01L21/336 主分类号 H01L29/78
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