发明名称 |
Method for fabricating bump electrodes with a leveling step for uniform heights |
摘要 |
Disclosed is a method for mounting a semiconductor element, the method requiring no strict flatness for a substrate and being reliable in a semiconductor device produced by mounting a semiconductor element on a circuit substrate. In the multilayer circuit substrate comprising bump electrodes formed of a conductive paste, a conductive adhesive is applied to the top of bump electrodes and then leveled to obtain the end portions on the bump electrodes with a high coplanarity in height. The semiconductor element is mounted on this substrate using a combination of a conductive resin and a sealing resin or an anisotropic conductive sheet. Every top of the bump electrodes after the conductive adhesive is applied has a high coplanarity. The semiconductor element can be mounted with high reliability, on the substrate having such a poor flatness of the electrode face that mounting by a conventional method can not be applied.
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申请公布号 |
US6207550(B1) |
申请公布日期 |
2001.03.27 |
申请号 |
US19980107319 |
申请日期 |
1998.06.30 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HASE NOBUHIRO;ITAGAKI MINEHIRO;NAKAMURA YOSHIFUMI;YUHAKU SATORU;TAKEZAWA HIROAKI;BESSHO YOSHIHIRO |
分类号 |
H05K1/18;H01L21/56;H01L21/60;H01L23/12;H01L23/498;H05K1/09;H05K1/11;H05K3/32;H05K3/40;(IPC1-7):H01L21/44 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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