| 摘要 |
A water soluble, non-ionic masking agent is used in the manufacture of printed circuit boards. The masking agent masks portions of the circuit board to prevent adhesion of solder, flux and the like. The masking agent includes a water soluble non-ionic binder resin, a cellulosic non-ionic filler, a non-ionic surfactant, at least one non-ionic associative thickener, and deionized water. The masking agent material is readily removed from the circuit board after manufacture and does not render further wash water processing ineffective. The masking agent is non-ionic, and thus does not agglomerate or clump downstream ion-exchange or filtration media.
|
