| 摘要 |
This invention relates to a wire bonding apparatus for bonding wire to a substrate wherein the components used to guide, bond and cut the wire have a reduced cross-sectional dimension near the substrate to enable close proximity, deep access, fine pitch bonding. This is accomplished in part by forming a wire guide integrally through a substantial portion of the bonding tool, thereby completely eliminating one component found in conventional wire bonding apparatus. This is further accomplished by tapering the size of the bonding tool toward the substrate such that the bonding tool in a lower portion has a smaller cross-sectional area. A cutter extends adjacent the lower portion of the bonding tool and into the area that would otherwise be occupied by the lower portion of the bonding tool if not for the taper. Thus, both the cutter and the lower portion of the bonding tool occupy a minimal amount of space adjacent the substrate.
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