Electromagnetic interference shield and gap filler for a circuit board

摘要

A suppression layer made from material that reduces EMI is placed between an circuit board and a heat sink. At least one opening in the suppression layer allows the top surface of at least one electronic component to be thermally coupled to the heat sink. In addition to reducing EMI, the suppression layer fills in the space created between the various components on the circuit board. Filling in the gaps prevents the heat sink from rocking and moving, thereby protecting the at least one component coupled to the heat sink from damage. Filling in the gaps with the suppression layer also allows the heat sink to achieve and maintain secure thermal contact with the at least one electronic component on the circuit board.