发明名称 |
Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
摘要 |
The invention comprises tungsten chemical-mechanical polishing processes using fixed abrasive polishing pads, and to tungsten layer chemical-mechanical polishing solutions specifically adapted for chemical-mechanical polishing with fixed abrasive pads. In one implementation, a semiconductor wafer having a layer comprising tungsten at greater than or equal to 50% molar is provided. Such is positioned in proximity with a fixed abrasive chemical-mechanical polishing pad. A tungsten layer chemical-mechanical polishing solution is provided intermediate the wafer and pad. The solution comprises a tungsten oxidizing component present at from about 0.5% to 15% by volume and a pH of less than or equal to about 6.0. The tungsten comprising layer is chemical-mechanical polished with the fixed abrasive pad with the tungsten layer chemical-mechanical polishing solution being received between the wafer and the pad. In one implementation, tungsten from the layer is oxidized with a solution comprising a tungsten oxidizing component present at from about 0.5% to 15% by volume and a pH of less than or equal to about 6.0. One or both of tungsten and tungsten oxide is then polished from the tungsten comprising layer with a fixed abrasive chemical-mechanical polishing pad. In one implementation, the invention comprises a tungsten layer chemical-mechanical polishing solution.
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申请公布号 |
US6206756(B1) |
申请公布日期 |
2001.03.27 |
申请号 |
US19980189703 |
申请日期 |
1998.11.10 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
CHOPRA DINESH;MEIKLE SCOTT G. |
分类号 |
B24B37/00;C09K3/14;C09K13/04;H01L21/304;H01L21/321;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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