发明名称 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin
摘要 A novolak resin precursor is composed of bonded phenolic moieties, one of the hydrogen atoms in the o- or p-positions relative to the hydroxy group of each phenolic moiety is substituted with an alkyl or alkenyl group having 1 to 3 carbon atoms, and the other two hydrogen atoms are bonded through methylene bonds. The content of ortho-ortho bonding is 30 to 70% relative to the number of total methylene bonds and the weight average molecular weight of the precursor is 300 to 10,000. A novolak resin is obtained from this precursor, and a positive photoresist composition comprises this novolak resin. The invention provides a positive photoresist composition that comprises less binuclear compounds, suppresses scum formation, is excellent in terms of definition and coating performance and provides a resist pattern having satisfactory heat resistance.
申请公布号 US6207788(B1) 申请公布日期 2001.03.27
申请号 US19980122177 申请日期 1998.07.24
申请人 TOKYO OHKA KOGYA CO., LTD. 发明人 MIYAGI KEN;DOI KOUSUKE;TAKAHASHI RYUUSAKU;KOHARA HIDEKATSU;NAKAYAMA TOSHIMASA
分类号 G03F7/022;C08G8/00;C08G8/10;C08L61/06;G03F7/023;H01L21/027;(IPC1-7):C08G14/04 主分类号 G03F7/022
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