发明名称 |
Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin |
摘要 |
A novolak resin precursor is composed of bonded phenolic moieties, one of the hydrogen atoms in the o- or p-positions relative to the hydroxy group of each phenolic moiety is substituted with an alkyl or alkenyl group having 1 to 3 carbon atoms, and the other two hydrogen atoms are bonded through methylene bonds. The content of ortho-ortho bonding is 30 to 70% relative to the number of total methylene bonds and the weight average molecular weight of the precursor is 300 to 10,000. A novolak resin is obtained from this precursor, and a positive photoresist composition comprises this novolak resin. The invention provides a positive photoresist composition that comprises less binuclear compounds, suppresses scum formation, is excellent in terms of definition and coating performance and provides a resist pattern having satisfactory heat resistance.
|
申请公布号 |
US6207788(B1) |
申请公布日期 |
2001.03.27 |
申请号 |
US19980122177 |
申请日期 |
1998.07.24 |
申请人 |
TOKYO OHKA KOGYA CO., LTD. |
发明人 |
MIYAGI KEN;DOI KOUSUKE;TAKAHASHI RYUUSAKU;KOHARA HIDEKATSU;NAKAYAMA TOSHIMASA |
分类号 |
G03F7/022;C08G8/00;C08G8/10;C08L61/06;G03F7/023;H01L21/027;(IPC1-7):C08G14/04 |
主分类号 |
G03F7/022 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|