| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin paste having a high hot adhesive strength and excellent stress relaxation properties by mixing an epoxy resin component comprising a liquid epoxy resin and an epoxy-containing reactive diluent in a specified weight ratio with a phenolic curing agent, a latent curing agent, a cure accelerator being a tertiary amine (salt), and an inorganic filler in a specified ratio. SOLUTION: This paste comprises 100 pts.wt. epoxy resin component comprising a liquid epoxy resin of formula I and an epoxy-containing reactive diluent in a weight ratio of 50:50 to 90:10; 10:30 pts.wt. phenolic curing agent; 0.5-5 pts.wt. latent curing agent; 0.1-10 pts.wt. per 100 pts.wt. above three components, 0.1-10 pts.wt. cure accelerator; and an inorganic filler. The reactive diluent is exemplified by phenyl glycidyl ether, and the latent curing agent is exemplified by dicyandiamide. The cure accelerator is desirably a salt of a tertiary amine selected from an alicyclic ultrabase, an imidazole, and the like, with a phenol or a basic acid. |
