发明名称 Method for manufacturing capacitor of semiconductor memory device having tantalum oxide film
摘要 A method for manufacturing a capacitor having a dielectric film formed of a tantalum oxide film. The method includes forming a lower electrode that is electrically connected to an active region of a semiconductor substrate. A pre-treatment film including a component selected from a group consisting of silicon oxide, silicon nitride, and combinations thereof, is formed on the surface of the lower electrode. A dielectric film is formed on the pre-treatment film using a Ta precursor. The dielectric film includes a first dielectric layer deposited at a first temperature selected from a designated temperature range, and a second dielectric layer deposited at a second temperature different from the first temperature and selected from the same designated temperature range. A thermal treatment is thereafter performed on the dielectric film in an oxygen atmosphere.
申请公布号 US6207489(B1) 申请公布日期 2001.03.27
申请号 US19990393186 申请日期 1999.09.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 NAM KAB-JIN;WON SEOK-JUN;PARK KI-YEON;HYUNG YONG-WOO;PARK YOUNG-WOOK
分类号 C03C23/00;C23C16/40;H01L21/02;H01L21/316;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 C03C23/00
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