METHOD AND DEVICE FOR FORMING PROJECTING ELECTRODE

摘要

PROBLEM TO BE SOLVED: To securely melt and join and electrode material composed of lead-free solder at a relatively low temperature and to form a projecting electrode. SOLUTION: A spherical electrode material 106 is arranged in a fluoriding treating chamber 222 of a fluoriding treating device 200, after its flat face 107 is formed in a flat face forming treating part 100. A discharge unit 210 of the fluoriding treating device 200 allows CF4 and water to be reacted with by discharge to produce HF and fluorides the electrode material 106 in the fluoriding treating chamber 222. The electrode material 106 is solidly joined to the terminal part 318 of a semiconductor chip 312 in a solid joining treating part 300 after the fluoriding treatment. The electrode material 106 solidly joined to the semiconductor chip 312 is carried into a melting treating part 400 by carrying device, is melted by a reflowing furnace 402 and is made into a semispherical projecting electrode.