发明名称 RESIN COMPOSITION AND COMPOSITE RESIN MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition excellent in heat bonding properties to various thermoplastic resins and flexibility, inexpensive and exhibiting excellent mechanical characteristics, and to obtain further a resin composition excellent in extrusion molding properties, and in contour extrusion molding properties in particular. SOLUTION: The resin composition comprises 100 pts.wt. of a styrene block copolymer (A), 0.5-500 pts.wt. of an acrylic resin (B) obtained by polymerizing or copolymerizing acrylic acid, methacrylic acid or a derivative thereof and 0-500 pts.wt. of a styrenic resin (C) obtained by polymerizing a vinyl cyanide monomer and an aromatic vinyl monomer. The composite resin molded article is obtained by compounding this resin composition with a thermoplastic resin.
申请公布号 JP2001081276(A) 申请公布日期 2001.03.27
申请号 JP19990316985 申请日期 1999.11.08
申请人 MITSUBISHI CHEM MKV CO 发明人 OSHIMA MASABUMI
分类号 C08L53/00;C08L25/12;C08L33/08;C08L51/00;C08L55/02;(IPC1-7):C08L53/00 主分类号 C08L53/00
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