Probe tip and method for making electrical contact with a solder ball contact of an integrated circuit device

摘要

An improved probe tip for making electrical contact with a solder ball of an integrated circuit device such as a BGA includes two perimeter point structures having interior angled edges which form a front hollow region in the probe tip for receiving the solder ball of a BGA. Each of the interior edges of the point structures includes an angled medial contact zone which tangentially contacts the solder ball received in the hollow region of the tip to produce minimal distortion of the solder ball. The method of the invention permits electrical contact with a solder ball of a BGA with minimal deformation of the solder ball. In accordance with the method, the contact between the probe tip and the solder ball is limited to tangential contacts around the solder ball below the solder ball's apex.