| 摘要 |
A carrier of semiconductor wafer transportation. The carrier comprising: a base; two or more walls mounted to the base, with a plurality of grooves for receiving wafers by lateral insertion thereinto through a mouth, the mouth defined by an upper wall and a substantially horizontal lower wall, wherein the groove comprises a closed end defined by a back wall joined to the upper wall and the lower wall so that the groove narrows from the mouth towards the closed end, the upper wall being slanted upward towards the mouth and the back wall being slanted towards the mouth in the region close to the horizontal wall.
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