| 摘要 |
A wireless assembly for communicating electrical signals between test equipment and a unit under test using contact probes having at a first end a head electrically connected to a test point on the unit under test and a contact at a second end. The wireless assembly includes a translator board electrically connected to the test equipment; a probe plate in a spaced relationship with the translator board, at least one probe socket having a compression ring and a contact, the probe socket being fitted through holes in the probe plate; and a contact receptacle provided on and electrically connected to the translator board. The contact receptacle provides wireless electrical interconnection between the probe and the translator board by exerting only a circumferential force on the probe, generally without exerting a static force on the translator board. The contact receptacle is configured to eliminate transient forces caused by flexure of the probe plate from being transmitted to the translator board. Further, in densely populated units under test, standard vias, i.e., a via with industry standard plated-through hole diameter, may be used as test pads. The contact receptacle may be connected directly to vias on the translator board.
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