| 发明名称 |
SEALING STRUCTURE FOR BUMPS ON A SEMICONDUCTOR INTEGRATED CIRCUIT |
| 摘要 |
<p>A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor integrated circuit chip. Each of the pads is formed with a bump thereon. A coating material is provided to coat at least surfaces of the above a plurality of bumps. The material is made of an insulation material having a hardness sufficiently small for showing, when bonding the chip onto the circuit board, a deformation thereby at least a top portion of each of the bumps is made contact with pads provided on the circuit board.</p> |
| 申请公布号 |
KR0163782(B1) |
申请公布日期 |
1999.02.01 |
| 申请号 |
KR19950021795 |
申请日期 |
1995.07.22 |
| 申请人 |
NIPPON ELECTRIC K.K. |
发明人 |
KUSAKA, TERUO;SENBA, NAOJI;NISHIZAWA, ATSUSHI;TAKAHASHI, NOBUAKI |
| 分类号 |
H01L21/56;H01L21/60;H01L23/485;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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