发明名称 Adhesive composition and method of bonding with the adhesive composition
摘要 An adhesive composition is provided which is flowable, shows a spreadable viscosity and a long pot life, develops cohesion by short-time exposure to a radiation, eliminates the need of temporary fixing, and exhibits the superior resistance to impact and creep after cure. The adhesive composition contains (X) a compound having a crosslinkable or polymerizable group and (Y) a compound which is activated when exposed to an active energy radiation to generate species that cause crosslinking or polymerization of at least a part of the compound (X); wherein the composition has a viscosity at 25 DEG C of 1 - 10,000,000 cps, a conversion of the compound (X) immediately after exposure of the adhesive composition to the active energy radiation does not exceed 70 %, a conversion of the compound (X) after exposure of the adhesive composition to the active energy radiation and subsequent 24-hour aging at 25 DEG C is in the range of 50 - 100 %, and after exposure of the adhesive composition to the active energy radiation and subsequent 24-hour aging at 25 DEG C, the cured composition has an elongation at break of 10 - 1,000 % and a dynamic tensile modulus in the range of 10<5>-10<9> Pa.
申请公布号 AU6728400(A) 申请公布日期 2001.03.26
申请号 AU20000067284 申请日期 2000.08.24
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 TAKEO KURODA;HIROJI FUKUI;HIDEAKI ISHIZAWA
分类号 C08F290/06;C08G18/10;C08G18/80;C09J4/06;C09J175/16;C09J201/10 主分类号 C08F290/06
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