| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat resistant insulation layer in which a maleimide compound is UV-curable and thermosetting at low temperature by employing a resin composition containing specified quantity of a bismaleimide compound, other resin component, and a thermosetting accelerator or a UV-curing starting agent, i.e., an acrydine compound represented by a specified structural formula, in the insulation layer. SOLUTION: A thermosetting or UV-curable resin compound containing (A) 5-90 wt.% of bismaleimide compound, (B) 10-95 wt.% of other resin component and (C) 0.1-30 pts.wt. of an acrydine compound, i.e., a thermosetting accelerator or a UV-curing starting agent, represented by formula I or II for total 100 pts.wt. of (A) and (B) is employed in the insulation layer of a multilayer wiring board. In the formula I, R2 , R3 , R4 , R5 , R6 , R7 , R8 and R9 represents, independently, hydrogen, halogen, alkyl group or alkoxy group of 1-8C, and R1 represents alkyl group of 1-8C. In the formula II, R10 represents alkylene group of 1-12C. An insulation layer thus obtained is excellent in heat resistance and employed for production of a multilayer wiring board. |
