| 摘要 |
The aim of the invention is to assemble, as efficiently as possible, a stack of wafers to be processed in any, however, predetermined order. To this end, a handling device for wafers is used that comprises a storing device in which a plurality of wafers can be arranged such that they are aligned, with the surfaces thereof, essentially parallel to one another, and can be arranged one behind the another and outside of a transport container. Said handling device also comprises a gripping device with which the individual wafers can be removed from the storing device and/or inserted therein. According to the invention, the gripping device (43) has a number of grippers (44) which can be jointly displaced but which can be actuated independent of one another, whereby at least one wafer can be grasped and/or inserted into the storing device (42) by actuating a gripper (44). |
