| 摘要 |
PROBLEM TO BE SOLVED: To shorten the heating/cooling processing time of a planar body to be treated, to uniformize the in-plane temperature distribution of the body under treatment and improve the manufacture yield. SOLUTION: A heat treatment part 100 having a heating unit 21A heating a semiconductor wafer W to a prescribed temperature and a cooling unit 11A for cooling it to the prescribed temperature, a resist processing part having at least either one of a resist applying device 12 applying resist solution to the semiconductor wafer W and a developing device 8 executing a developing processing thereon, a main arm 5 for transferring the semiconductor wafer W between the heat treatment part 100 and the resist processing part, and a sub-arm 90 for transferring the semiconductor wafer W between the prescribed units in the heat treatment part. A cooling temperature adjusting body 40 for cooling the semiconductor wafer W to a prescribed temperature is installed in the sub-arm 90. |
