| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device at low cost. SOLUTION: This semiconductor device includes a semiconductor element 10, having a main surface provided with an array of element electrodes 11, a barrier metal 12 formed on each electrode 11, a second elastic body layer 21 formed, so as to cover a step 25 of a first elastic body layer 20 formed on the main surface of the element 10, and a metallized wiring pattern 33 formed on the layer 21 and connected electrically to the metal 12. A wiring layer 31, which extends from a pad located on each metal 12, is electrically connected to a land 32 that functions as an external electrode.
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