| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module having high electrical insulating property and high thermal conductivity by preventing generation of parts which are not yet filled, without increasing resin viscosity when resin sealing is performed. SOLUTION: This semiconductor module is provided with a package 15 sealed with a resin M, a chip mounting head 12 whose one end is positioned in the package 15, and the other end is arranged to one end of a lead frame 11 the one end of which is protruded from a side part of the package 15 and which chip mounting head is retained with suspension leads 11a, an IC chip 13 mounted on the chip mounting head 12, and a heat sink 14 which is so arranged that one surface side is positioned in the package 15 and faces the back side of the chip mounting head 12. A bump-shaped resin 16 which is previously cured is formed at a position facing the neighborhood of a part of the one surface side of the head sink 14, on which part at least the suspension leads 11a are not formed.</p> |
