PRINTED BOARD AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To obtain a printed board having via holes which exhibit a high reliability of interlayer connection and its manufacture method. SOLUTION: This printed board has an insulating layer 5, in which at least one via hole 3 is formed, a spherical metal 1 which is inserted into the via hole 3 and has at least a size equal to the thickness of the insulating layer 5 and electrode layers 2 which are formed on the upper and lower sides of the insulating layer 5. The spherical metal 1 and the electrode layers 2 are metal diffusion bonded at the upper and lower openings of the via hole 3.