发明名称 SEMICONDUCTOR DEVICE ASSEMBLY AND ELECTRIC CIRCUIT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To make the current densities in different current flowing routes equal to each other by making the lengths of the routes equal to each other in a semiconductor device assembly. SOLUTION: A semiconductor device assembly is constituted in such a way that, on one side of a semiconductor device 1, an input end section 2 and an input-side connector 4 which connects the end section 2 to one side of the device 1 are provided and, on the other side of the device 1, an output-side connecting body 5 which makes the lengths of the connector 4 and current flowing routes equal to each other is provided. In addition, an output end section 3 is provided at the end of the connector 5 opposite to the input end section 2. Therefore, the lengths of current flowing routes from the input end section 2 to the output end section 3 can be made equal to each other regardless of the passing positions of the routes in the device 1 and, accordingly, the current densities in the routes can be fixed regardless of the routes.
申请公布号 JP2001077302(A) 申请公布日期 2001.03.23
申请号 JP19990252121 申请日期 1999.09.06
申请人 TOSHIBA CORP 发明人 SEN HITOSHI;WATANABE YUKIO
分类号 H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L25/07
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