| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting electronic components, which reduces solder bridges, and minimizes the decrease in the quantity of solder, and does not cause residual open-circuit defects, by restraining solder from connecting each other after preheating after mounting electronic components or after preheating before a reflow. SOLUTION: In this mounting method, a QFP1 and a printed board 3, which is provided with plural pads 4 matching the mounting position of the QFP1, are prepared. Then, using a mask member 8, solder paste is printed on the pad part 4 of the printed board 3 to form a printed body 2. The form of the printed body 2 is substantially band-shaped, and a constriction 6 is made so that the width is narrowed by 10-20% as compared with other sections, in a section where the ground part 5a of the lead terminal 5 of the PFP1 contact it. Then, the ground part 5a of the lead terminal 5 is soldered to a section which is made thin, with the constriction 6 in the printed body 2 made, whereby it is electrically connected to the section.
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