| 摘要 |
PROBLEM TO BE SOLVED: To obtain a laminated ceramic electronic component of high reliability, in which irregularities of characteristic is restrained and handling of a ceramic laminate after be-binder treatment is improved, by uniformly eliminating organic matters from a ceramic laminate during be-bind for each ceramic laminate. SOLUTION: When an unbaked ceramic laminate 3 is subjected to de-binder treatment in this manufacturing method, an organic matter of 0.50-8.5 wt.%, desirably, of 1.0-5.0 wt.% is left in the ceramic laminate 3 after the de-binder treatment. This de-binder treatment process is performed in an atmospheric gas using an inert gas. In the de-binder process, the debinder start temperature of internal electrodes 5, 6 of the unbaked ceramic laminate 3 is set higher than that of a ceramic layer 7.
|
