| 摘要 |
PROBLEM TO BE SOLVED: To obtain an arranging method for bonding balls and the device, when an electronic circuit is assembled as a chip or a surface mount components on a substrate. SOLUTION: A hole pattern 26 is maintained at a portion at a distance dp from a support body 21 lower than the bonding balls. A substrate 22 is arranged on the support body 21 and solder paste or flux 29 is applied at the position on the substrate 22 where the bonding balls are placed. The hole pattern has a pattern of a hole 27 which is provided facing the position where the bonding balls of the supporting body 21 are placed. The hole pattern 26 and the support body 21 makes a pendulum swing once at least, making the bonding ball 28 flow from a reservoir 200 united with the hole pattern 26 and each hole 27 is filled with the bonding ball 28 by crossing over the surface of the pattern, and is arranged at the position corresponding to the substrate.
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