| 摘要 |
PROBLEM TO BE SOLVED: To reduce inductance and to improve mechanical vibration resistance and electric vibration resistance by overlapping a pair or two pairs of confronted conductive plates across an insulating object, electrically connecting the confronted conductive plates to respective capacitors and making a capacitor element aggregate. SOLUTION: In a low inductance capacitor, a pair of conductive plates 2 are overlapped across an insulating object 1 and capacitor elements 3 are arranged on both sides through insulating paper 4 where parts between the capacitors 3 are folded in mountain shapes. Lead wires 5 to an element metallikon surface from the conductive plate 2 are drawn from a space between the capacitor elements 3 and they are electrically connected. A loop surrounded by wiring is considerably small and inductance can remarkably be reduced by the low inductance capacitor of the capacitor element aggregate with such constitution. Thus, wiring can be executed with the saved space by structure for drawing the lead wires 5 from the space between the capacitor element 3.
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