GATE REMAINDER CUTTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a gate remainder cutting device which smoothly discharge a gate remainder which is cut and can prevent the fault of the device owing to the gate remainder and the crack of a semiconductor chip package. SOLUTION: A gate remainder cutting die 50 which is positioned below a lead frame 90 and has a discharge port 52 and a fixed projection 54 and a gate remainder cutting punch die which is positioned above the lead frame 90 and has a cutting punch 72 and a pressure projection 74 are provided for removing the gate remainder remaining in a package body. An air in-flow port is secured for the cutting punch 72 of the gate remainder cutting punch die by forming a through hole as the route of air, which supplies the continuous flow of air at the time of the cutting process of the gate remainder 94. A dam bar cutting die cutting a dam bar and a punch die are provided near the gate remainder cutting die 50.