| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a semiconductor chip stable in characteristics by a method wherein a cooling cycle step is executed for the semiconductor chip prior to a characteristic adjusting step or a characteristic inspection step after a step accompanied by heating. SOLUTION: A cooling cycle step is executed for a semiconductor sensor chip in which a distortion has been generated, whereby the semiconductor sensor chip repeats expansion and contraction, so a distortion is considered to converge toward a stable point (no distortion) and a stress of a thin part of the semiconductor sensor chip is considered to fluctuated toward a decrease finally. Accordingly, a distortion of the semiconductor sensor chip can be removed in a short time by executing the cooling cycle step. Thereby, if cooling cycles 1, 2, 3 steps are executed after an assembling step accompanied by heating, characteristics of a G sensor can be stabilized, and in the stable condition, an output adjustment is carried out, whereby an output fluctuation after the adjustment is reduced or electric characteristics can be inspected in the stable condition.</p> |
