| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve radiation of the heat produced by a semiconductor chip in a semiconductor device called 'BGA'(ball grid array). SOLUTION: Radiating bump electrodes 21, provided on the lower surface of a semiconductor chip 2, are jointed to a radiating pattern 22 provided on the upper surface of a film substrate 3. The pattern 22 arranged at locations outside a semiconductor chip mounting region on the upper surface of the substrate 3 is jointed to a radiating pattern 23 provided on the upper surface of a circuit board 10, in such a manner that the portions of the substrate 3 at these locations is bent by substantially 180 deg.C in a prescribed directions.</p> |
