LEAD FRAME AND MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent burrs at the end face of a lead when cutting with a blade, in a lead cutting process after resin sealed. SOLUTION: A lead frame has a portion 13 thinner than the other portion at a cut portion 5 of a lead 4, wherein the thickness and the width of the cut portion 5 is set at values which do not hamper blade cutting. Therefore, when the lead frame is cut with a rotary blade 11, it is possible to prevent burrs and hence to eliminate defects of lead, which results in ensuring the packaging reliability of a resin-sealed semiconductor device.