| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor substrate retaining method which can be used for a high-temperature heat treatment process of about >=350 deg.C. SOLUTION: In a method for manufacturing electronic parts, electronic parts are manufactured in such a way that, after a circuit having wiring and a function is formed on one surface (A) of a semiconductor substrate (SE) having a thickness of >=0.2 mm, a semiconductor circuit board (PSE) is obtained by retaining (AS) the surface (A) on a retaining substrate (BP) by bonding the surface (A) to the substrate (BP), reducing the thickness of the substrate SE to <0.2 mm by polishing the exposed surface (B) opposite to the surface (A) by a physical, chemical, or composite method, and then, forming a circuit having wiring and a function on the surface (B). Then the circuit board (PSE) is peeled (PS) from the retaining substrate (BP). In this case, the steps from the step of polishing the surface (B) to the step of forming the circuit on the surface (B) include a high-temperature heat-treating step of >=350 deg.C. In addition, a heat-resistant thermoplastic resin (HR) is used for bonding and retaining (AS) the surface (A) to and on the retaining substrate (BP). Therefore, this method can be applied to a semiconductor circuit manufacturing process containing a high-temperature heat-treating step of >=350 deg.C in the steps from a step of polishing the rear surface (exposed surface) of a substrate to a step of forming circuit on the rear surface.
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