| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board for mounting a semiconductor element, in which board burrs are not generated. SOLUTION: This printed wiring board is provided with a wiring board 20, where a plurality of unit patterns A constituted of a desired number of wiring patterns 22 which are to be electrically connected with semiconductor elements and semiconductor element accommodating holes 21 for accommodating the semiconductor elements are plurally arranged in parallel, a metal plate 25 for heat radiation, which is fixed on the back of the wiring board 20, and trenches 27 which are formed at the boundary parts of the unit patterns A and reach from the metal plate 25 side to the wiring board 20 side and from which the wiring board 20 is exposed by a prescribed width. Unit printed wiring boards 29 are interconnected through exposure part positions 28 exposed in the trenches 27 of the wiring board 20.
|
