| 摘要 |
PROBLEM TO BE SOLVED: To enable a resin layer applied on the surface of a part board to be separated from castellations so as to prevent sealing resin from leaking out to the surfaces of terminals by a method wherein castellations are not provided to the part board but a terminal board. SOLUTION: IC chips 2 and chip parts 3 are formed on the mounting side of a part board 1. The connection terminals 7 of the IC chip 2 are connected to through holes 5 through the intermediary of wires 4. The through holes 5 are bored in the part board 1 penetrating it from above its front to rear. No castellation is provided for the part board 1. Connection terminals 7 are provided for the edge faces of the terminal board 6. Nearly semicircular circular castellations 8 subjected to plating are provided on the side faces of the terminal board 6. By this setup, the resin of a sealing resin layer and the castellations are physically separated from each other, and the resin of the sealing resin layer 8 can be prevented from leaking out.
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