发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can improve its processing ability, without making it complicated. SOLUTION: When a wafer is transferred between a plurality of processing units within a processing station 11 and when secondary wafer transfer devices 21 and 24 for feeding in or out are normally not operated within a cassette station 10 or an interface section 12 in a normal mode, the secondary transfer devices 21 and 24 transfer the wafer between the plurality of processing units within the processing station 11 and assist part of a transfer step of a primary wafer transfer device 46.
申请公布号 JP2001077176(A) 申请公布日期 2001.03.23
申请号 JP20000195646 申请日期 2000.06.29
申请人 TOKYO ELECTRON LTD 发明人 UEDA KAZUNARI
分类号 H01L21/677;H01L21/027;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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