MANUFACTURE OF RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: After a metal sheet 13 having an adhesive 14 is bonded to a lead portion 4 and resin sealed, leads are cut with a blade. Then, by peeling off the metal sheet 13 together with the adhesive 14, bent portions 12 (metal burrs) generated on the cut end surface of the lead portion 4 can be removed and a resin sealed semiconductor device wit high mounting reliability can be obtained.