| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and a printed wiring board for the semiconductor package, capable of both improving their electrical characteristics and reducing their manufacturing cost. SOLUTION: A ground pattern 12 and a power source pattern 13 formed on the surface of a printed wiring board 10 are connected to a ground layer 21 and to a power source layer 22 formed as inner layers via bumps 24a and 24b. Thus, there is no need for applying a uniform coating over the inner side of a cavity 43 for the connection of the pattern 12 to the layer 21, and this hence contributes to improvement of yield and reduction of cost. Furthermore, unlike connection between the pattern 13 and the layer 22, using through holes which requires some distance between the pattern 13 and a signal pin 14 to provide a through hole forming region, the connection using the bumps makes their distance shorter. As a result, the distance between a chip 41 and the pin 14 is shortened, and hence the electrical characteristics are improved. |
