| 摘要 |
PROBLEM TO BE SOLVED: To form a land electrode of the bottom surface of a resin-sealed semiconductor device from a frame, without using a circuit board and to reduce manufacturing cost and to improve the packaging reliability of substrate. SOLUTION: In a lead frame for a land grid array, by disposing the surface of the land electrode 16 of a land lead portion 4 in advance, whose bottom becomes the land electrode 16, below the land surface of a lead portion 5 by a half-cut portion 24 with a tilting angle, in a resin-sealing process using a sealing sheet, the land electrode 16 bites into the sealing sheet 20 and close contact the sealing sheet 20 by pressing a die, thereby preventing the resin from flowing into the surface of the land electrode 16, which results in preventing the resin from producing fins on the surface of the land electrode 16 of the land lead portion 4. |
