| 摘要 |
PROBLEM TO BE SOLVED: To successively reduce alignment failures at use of a mobile aligner, without generating decrease in IC chip yield or the like. SOLUTION: In this method for manufacturing semiconductor devices, fine adjustment alignment targets 25, 26, 27, and 31 are arranged along a scribe line 29 in the X-direction among scribe lines 29X and 29Y in the X and Y- directions, dividing plural chip patterns 21 on a semiconductor wafer 24. The fine adjustment alignment target 31 formed at a cross part with the scribe line 29Y in the Y-direction is used for alignment, after a metal pattern 30 is formed at the edge part of each chip pattern 21. In this case, a metal pattern 30 will not be formed in an area 31a which is within 75μm from the center of the fine adjustment alignment target 31. |
