| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, capable of preventing disconnection of regular wirings by allowing dummy wirings to block the growth of cracks, and preventing crackings and subsequent disconnections of the wirings by eliminating stress concentrations at peeled-off portions. SOLUTION: A BGA(ball grid array) surface-mount package is of a molded structure 2, where a chip is mounted on a substrate and sealed with a sealing material. Dummy metallized wirings 16 are provided, in order to prevent breake of regular metallized wirings 13 (13a to 13d) on a fourth layer on the underside of the substrate 2. The wirings 16 are provided on both sides or on one side along the conductors 13, or so as to fill the clearances between the wirings 13, or the wirings 13 and 16 are formed to be relatively large in width. Furthermore, a resist is provided with openings which are formed in a first layer of the surface of the substrate 2, at locations where the resist and the sealing material are easily peeled off.
|
