| 摘要 |
PROBLEM TO BE SOLVED: To provide a joint structure of a ceramic board and a metallic heat sink, which has superior heat dissipation even under cooling environment. SOLUTION: In a joint structure of a ceramic board 4 and a metallic radiator 6, a metallic circuit is formed on one surface of the ceramic board 4 and the metallic heat sink 6 is formed on the other surface thereof by means of a joint layer 5, and the joint layer 5 has a thermal conductivity of 10 W/m K or higher, and a thickness of 20 to 300μm. Thus, since the calorific value of a semiconductor element due to high output of a power module increases, the temperature of a constituent metallic material rises, and even when peeling stress due to the difference in thermal expansion between the ceramic board and metallic material works, the stress can be absorbed and the adherence to the heat sink can be kept.
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