| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of thick flashes of sealing resin in a lower mold, and damages to a sealing resin cutting part. SOLUTION: A lead frame having a rough upper mold 60a and a flat lower mold 60b is provided with a thin-wall part 60c for mounting a semiconductor chip 21, a plurality of first thick-wall parts 60d for constituting lead electrodes 23, second thin-wall parts 60e provided between the plurality of first thin-wall parts, third thin-wall parts 60f provided, so as to surround the plurality of first thick-wall parts and second thick-wall parts 60g provided around the third thin-wall parts. The first, second and third thin-wall parts have approximately the same thickness. A recessed part 60h having peripheral part 60i is formed with the first, second and third thin-wall parts, and a protruded part is formed by the first and second thin-wall parts. |
